LNX State of the Art Automated Assembly 

 

 

 

 

 

 

 

State of the art automated assembly equipment and techniques are essential in a market requiring high precision and quick turn around times. Our experience enables us to program the automated equipment in just a few hours. This allows us to utilize the automation also for small volumes yielding the associated accuracy and repeatability. For large production volumes, the same automation provides fast manufacturing ramp up times. ISO 9001:2000 certification was obtained in December of 2003.

 The LNX automated assembly is complete from SMT to wire bonding. We utilize a unique substrate attachment method. Dot dispensing of epoxy, solder paste and chip placement is done by fully automatic equipment. Ultra precision epoxy and bare die placement is preformed by our MRSI 170/505 pair. Placement accuracies of .002" can be achieved for the demands of high frequency components. As geometries decrease in size, accurate and repeatable wire bonding is critical. Our primary wire bonding is done on a Palomar 2470-V automatic ribbon bonder, and a Huges 2460-III Automatic Ball Bonder.

All processes are held under strict control and changes to processes are extensively researched prior to implementation. An experienced manufacturing engineer staff competent in process and test functions is continually implementing cost reducing disciplines and techniques that are crucial to customer satisfaction