12,000 sqft facility includes 6,000 sq. ft. of class 100,000 clean room manufacturing space.
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Vacuum substrate attachment. |
Lead-free SMT capability- 0603 package minimum
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Epoxy die attach using MRSI 170 and 505- Extremely high repeatability and accuracy Significantly less component damage- Fast modular programming
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Automated wedge and ball bonding- Palomar 2470-V (.002” x .0005” ribbon)- Palomar 2460-IV (.001” to .002” wire) |
Bond verification and control through strict use of SPC.- Dage 4000 series bond pull/die shear
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Highly skilled, specialized assembly staff- Feedthru installation- Hand soldering- Gold coils and beam leads |
Eutectic die/substrate attach |
Manual bonding (.0007” to .002”) |
